Heat dissipation device with fastener and flange

ABSTRACT

A heat dissipation device includes a base and a fastener. The fastener includes a neck portion, a head portion formed at one end of the neck portion, and an engaging portion formed at another opposite end of the neck portion. The base defines a receiving portion through the base. The receiving portion includes an inserting hole and a mounting hole communicating with the inserting hole. A flange extends upwardly from the base toward the mounting hole. The engaging portion extends through the inserting hole from a top of the base to make the neck portion enter the inserting hole. The neck portion is then crushed into the mounting hole from the inserting hole. A top face of the head portion abuts the flange, a bottom face of the head portion abuts the base.

CROSS-REFERENCE TO RELATED APPLICATION

This application is related to a co-pending application entitled “HEAT DISSIPATION DEVICE WITH FASTENER” application Ser. No. 13/592356, assigned to the same assignee of this application and filed on the same date. The disclosure of the co-pending application is wholly incorporated herein by reference.

BACKGROUND

1. Technical Field

The disclosure relates to heat dissipation devices and, more particularly, to a heat dissipation device with a fastener for fastening the heat dissipation device on a printed circuit board.

2. Description of Related Art

It is well known that, during operation of a computer, electronic devices such as central processing units (CPUs) frequently generate large amounts of heat. The heat must be quickly removed from the electronic device to prevent it from becoming unstable or being damaged. Typically, a heat sink is attached to an outer surface of the electronic device to absorb heat from the electronic device. The heat absorbed by the heat sink is then dissipated to ambient air.

In order to keep the heat sink in intimate contact with the electronic device, a fastener extends through the heat sink and a printed circuit board where the electronic device is located to fasten the heat sink to the electronic device. However, before the heat sink mounted on the electronic device, the fastener is usually pre-assembled on the heat sink by an annular collar which snaps with an end of the fastener extending beyond the heat sink, for facilitating transportation. However, the collar is prone to disengage from the fastener when subjected to an outer force during transportation, resulting in falling of the fastener from the heat sink.

What is needed, therefore, is a heat dissipation device with a fastener which can overcome the limitations described.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an isometric, exploded view of a heat dissipation device in accordance with a first embodiment of the disclosure.

FIG. 2 is an assembled view of the heat dissipation device of FIG. 1, wherein a fastener of the heat dissipation device is in a released position.

FIG. 3 is an assembled view similar to FIG. 2, wherein the fastener of the heat dissipation device is in a locked position.

FIG. 4 is an isometric, exploded view of a heat dissipation device in accordance with a second embodiment of the disclosure.

FIG. 5 is an isometric, exploded view of a heat dissipation device in accordance with a third embodiment of the disclosure.

DETAILED DESCRIPTION

Referring to FIGS. 1-2, a heat dissipation device 100 in accordance with a first embodiment of the disclosure is shown. The heat dissipation device 100 is for dissipating heat generated by an electronic device (not shown) mounted on a printed circuit board (not shown). The heat dissipation device 100 includes a base 10, and a fastener 20 for fastening the heat dissipation device 100 on the printed circuit board.

The base 10 includes a rectangular conductive plate 11 and two elongated arms 13 fixed at two opposite sides of the conductive plate 11. Each end of the arm 13 defines a receiving portion 14 through the arm 13. The receiving portion 14 includes an arc-shaped mounting hole 142, an arc-shaped inserting hole 144, and a guiding groove 147 communicating with the mounting hole 142 and the inserting hole 144. The arm 13 has an arc-shaped outer edge 132 at a periphery of the mounting hole 142. A plurality of spaced flanges 134 extend upwardly from the outer edge 132 of the arm 13 toward the mounting hole 142. The flanges 134 are integrally formed with the arm 13 as a single piece. The flanges 134 and the arm 13 cooperatively define a receiving space 146 located above the mounting hole 142. Each flange 134 has an arc-shaped outer edge 136 away from the arm 13. The outer edges 136 of all flanges 134 are located in a same circle. An edge of the guiding groove 147 is tangential to an arc-shaped edge of the inserting hole 144. Width of the guiding groove 147 decreases along a direction from the inserting hole 144 to the mounting hole 142. The width of the guiding groove 147 has the minimum value at a joint of the guiding groove 147 and the mounting hole 142. The inserting hole 144 has a diameter larger than the width of the guiding groove 147 but smaller than a diameter of the mounting hole 142.

The fastener 20 includes a column-shaped neck portion 212, a circular head portion 211 extending from a top end of the neck portion 212, and a column-shaped engaging portion 210 extending from an opposite bottom end of the neck portion 212. The engaging portion 210 has a diameter smaller than that of the head portion 211 but larger than that of the neck portion 212.

The engaging portion 210 defines a plurality of threads on a periphery thereof. The diameter of the engaging portion 210 is equal to or smaller than that of the inserting hole 144 of the receiving portion 14, but larger than the width of the guiding groove 147. The diameter of the engaging portion 210 is also smaller than the diameter of the mounting hole 142 of the receiving portion 14.

The diameter of the neck portion 212 is smaller than the width of a portion of the guiding groove 147 near the inserting hole 144, only slightly larger than the minimum width of the guiding groove 147. The diameter of the neck portion 212 is also smaller than the diameter of each of the inserting hole 144 and the mounting hole 142.

The head portion 211 defines an operating groove 216 in a top face thereof for facilitating operation of a tool such as a screwdriver to fasten the fastener 20 to the printed circuit board. A diameter of the circle where the outer edges 136 of the flanges 134 are located, the diameter of the mounting hole 142 and the diameter of the inserting hole 144 are smaller than that of the head portion 211.

Also referring to FIG. 3, in assembly, the engaging portion 210 of the fastener 20 extends down through the inserting hole 144 from a top side of the base 10 to make the neck portion 212 enter the inserting hole 144, so that the head portion 211 and the engaging portion 210 are respectively located at top and bottom sides of the base 10. The fastener 20 is then moved horizontally from the inserting hole 144 towards the mounting hole 142. Since the diameter of the neck portion 212 is slightly larger than the minimum width at a joint of the guiding groove 147 and the mounting hole 142, the neck portion 212 is snugly moved into the mounting hole 142 from the joint of the guiding groove 147 and the mounting hole 142. The head portion 211 is received in the receiving space 146. A top face of the head portion 211 abuts the flanges 134, a bottom face of the head portion 211 abuts the top side of the base 10 at a periphery of the mounting hole 142. Thus, the fastener 20 is securely fastened on the base 10.

Referring to FIG. 4, a heat dissipation device 100 a in accordance with a second embodiment of the disclosure is shown. The heat dissipation device 100 a includes a base 10 a and a fastener 20 a.

The base 10 a includes a rectangular conductive plate 11 a and two elongated arms 13 a fixed at two opposite sides of the conductive plate 11 a. Each end of the arm 13 a defines a receiving portion 14 a through the arm 13 a. The receiving portion 14 a includes an arc-shaped mounting hole 142 a, an arc-shaped inserting hole 144 a, and a guiding groove 147 a communicating with the mounting hole 142 a and the inserting hole 144 a.

The fastener 20 a includes a column-shaped neck portion 212 a, a circular head portion 211 a extending from a top end of the neck portion 212 a, and a column-shaped engaging portion 210 a extending from an opposite bottom end of the neck portion 212 a. A diameter of the neck portion 212 a is slightly larger than the minimum width at a joint of the guiding groove 147 a and the mounting hole 142 a.

The differences between the first embodiment and the second embodiment are in that: there are no flanges extending from the arm 13 a; the diameter of the engaging portion 210 a is larger than that of the mounting hole 142 a; when the neck portion 212 a is crushed into the mounting hole 142 a from the joint of the guiding groove 147 a and the mounting hole 142 a, the engaging portion 210 a abuts a bottom side of the base 10 a at a periphery of the mounting hole 142 a, the head portion 211 a abuts a top side of the base 10 a at the periphery of the mounting hole 142 a.

Referring to FIG. 5, a heat dissipation device 100 b in accordance with a third embodiment of the disclosure is shown. The heat dissipation device 100 b includes a base 10 b and a fastener 20 b.

The base 10 b defines a receiving portion 14 b through the base 10 b. The receiving portion 14 b includes an arc-shaped mounting hole 142 b, an arc-shaped inserting hole 144 b, and a guiding groove 147 b communicating with the mounting hole 142 b and the inserting hole 144 b. A plurality of spaced flanges 134 b extend upwardly from an outer edge of the base 10 b toward the mounting hole 142 b.

The fastener 20 b includes a column-shaped neck portion 212 b, a circular head portion 211 b extending from a top end of the neck portion 212 b, and a column-shaped engaging portion 210 b extending from an opposite bottom end of the neck portion 212 b.

The differences between the first embodiment and the third embodiment are in that: the guiding groove 147 b has a same width along a direction from the inserting hole 144 b to the mounting hole 142 b, and a diameter of the neck portion 212 b is slightly larger than the width of the guiding groove 147 b.

It is believed that the disclosure and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention. 

What is claimed is:
 1. A heat dissipation device, comprising: a base defining a receiving portion therethrough, the receiving portion comprising an inserting hole and a mounting hole in communication with the inserting hole; and a fastener comprising a neck portion, a head portion formed at one end of the neck portion, an engaging portion formed at another opposite end of the neck portion, the engaging portion having a diameter smaller than a diameter of each of the inserting hole and the mounting hole, the head portion having a diameter larger than the diameter of each of the inserting hole and the mounting hole, at least one flange extending upwardly from the base toward the mounting hole, the engaging portion extending downwardly through the inserting hole from a top side of the base to make the neck portion enter the inserting hole, so that the head portion and the engaging portion are respectively located at top and bottom sides of the base, the fastener being then moved from the inserting hole towards the mounting hole, so that the neck portion is snugly moved into the mounting hole from the inserting hole, a top face of the head portion abutting the at least one flange, a bottom face of the head portion abutting the base at a periphery of the mounting hole.
 2. The heat dissipation device of claim 1, wherein the receiving portion further comprises a guiding groove communicating with the inserting hole and the mounting hole, a width at a joint of the guiding groove and the mounting hole is smaller than the width of the opening of the guiding groove and the diameter of the mounting hole, a diameter of the neck portion being slightly larger than the width at the joint of the guiding groove and the mounting hole.
 3. The heat dissipation device of claim 1, wherein the receiving portion further comprises a guiding groove communicating with the inserting hole and the mounting hole, the diameter of the neck portion being slightly larger than a width at a joint of the guiding groove and the mounting hole, the neck portion being snugly moved into the mounting hole from the joint of the guiding groove and the mounting hole.
 4. The heat dissipation device of claim 3, wherein the width of the guiding groove decreases along a direction from the inserting hole to the mounting hole.
 5. The heat dissipation device of claim 4, wherein the inserting hole is arc-shaped, an edge of the guiding groove being tangential to an arc-shaped edge of the inserting hole, the diameter of the inserting hole being larger than the width of the guiding groove.
 6. The heat dissipation device of claim 3, wherein the guiding groove has a same width along a direction from the inserting hole to the mounting hole.
 7. The heat dissipation device of claim 6, wherein the inserting hole is arc-shaped, the diameter of the inserting hole being larger than the width of the guiding groove.
 8. The heat dissipation device of claim 1, wherein the at least one flange comprises multiple flanges, each of the multiple flanges has an arc-shaped outer edge away from the base, the outer edges of the flanges being located in a same circle, a diameter of the circle where the outer edges of the flanges are located being smaller than that of the head portion.
 9. The heat dissipation device of claim 1, wherein the base comprises a conductive plate and two elongated arms fixed at two opposite sides of the conductive plate, each end of the arm defines the receiving portion through the arm.
 10. The heat dissipation device of claim 9, wherein the arm has an arc-shaped outer edge at a periphery of the mounting hole, the at least one flange extending upwardly from the outer edge of the arm toward the mounting hole.
 11. A heat dissipation device, comprising: a base defining a receiving portion through the base, the receiving portion comprising an inserting hole and a mounting hole communicating with the inserting hole; and a fastener comprising a neck portion and a head portion formed at one end of the neck portion, the neck portion having a diameter smaller than a diameter of each of the inserting hole and the mounting hole, the head portion having a diameter larger than the diameter of each of the inserting hole and the mounting hole, a plurality of flanges extending upwardly from the base toward the mounting hole, the neck portion extending downwardly through the inserting hole from a top side of the base to make a bottom face of the head portion abut the top side of the base at a periphery of the inserting hole, the fastener being then moved from the inserting hole towards the mounting hole, a top face of the head portion abutting the flanges, the bottom face of the head portion abutting the base at a periphery of the mounting hole.
 12. The heat dissipation device of claim 11, wherein the receiving portion further comprises a guiding groove communicating with the inserting hole and the mounting hole, a width at a joint of the guiding groove and the mounting hole is smaller than the width of the opening of the guiding groove and the diameter of the mounting hole, the diameter of the neck portion being slightly larger than the width at the joint of the guiding groove and the mounting hole.
 13. The heat dissipation device of claim 11, wherein the receiving portion further comprises a guiding groove communicating with the inserting hole and the mounting hole, the diameter of the neck portion being slightly larger than a width at a joint of the guiding groove and the mounting hole, the neck portion being snugly moved into the mounting hole from the joint of the guiding groove and the mounting hole.
 14. The heat dissipation device of claim 13, wherein the width of the guiding groove decreases along a direction from the inserting hole to the mounting hole.
 15. The heat dissipation device of claim 14, wherein the inserting hole is arc-shaped, an edge of the guiding groove being tangential to an arc-shaped edge of the inserting hole, the diameter of the inserting hole being larger than the width of the guiding groove. 